Automatic heating-area adjustment
Chip-size recognition and automatic spot adjustment align the illuminated area with the target component.
THE WORKSTATION
A desktop system designed to apply controlled laser heating to selected PCB areas, supporting localized solder reflow, component removal and replacement workflows.

CORE CAPABILITIES
Chip-size recognition and automatic spot adjustment align the illuminated area with the target component.
Temperature feedback, configurable heating profiles and stored parameters support process setup and repeat tasks.
Use worktable preheating for tasks that require it, with board-holding fixtures planned for the workstation.
The workstation is designed to support extended professional work sessions. Continuous operating limits will be specified following validation.
FROM THE WORKBENCH
Early demonstrations include laser-assisted component removal. They show a task under its development conditions; solder-joint quality requires its own inspection.
WORKSTATION FAQ